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Superior Thermal Performance: DFN packages offer significantly lower thermal resistance compared to traditional leaded packages, improving device efficiency and reliability.

Industry 5.0, automation, robots, human-centric, sustainability, edge computing, Samtec, distributor, industrial automation, Industry 4.0, artificial intelligence, machine learning

Samtec, Ultra Micro connectors, high-speed performance, automotive applications, Micro Blade & Beam connectors

Scalability Through Interconnection

Pogo pins, contact pins, or spring-loaded connectors

Technology Revolutionizes High-Density RF Interconnects

High-speed data transfer,Data connectivity,Samtec,SiFly connector,Telemetry,Broadcasting,Fan engagement,Operational efficiency

D-sub connectors are easily recognizable by their distinctive D-shaped metal shield.

AMD Versal AI Edge, AI at the Edge, VE2302 SoM, System-on-Module, Avnet Development Kit, Samtec AcceleRate® HD Connectors, High-Density Interconnects, Edge AI Applications

The AcceleRate® HP cable system provides an excellent mix of density and performance.

The EVK-PLA1060 offers a small footprint and high power density, making it ideal for space-constrained off-highway vehicles.

High-speed data acquisition: Enabling the capture and processing of large volumes of data at high speeds.

Radiall, IMP connectors, high-frequency, low phase noise, solderless, compact, interconnect, aerospace, defense, telecommunications, industrial automation, medical devices

Addressing the Demands of Modern Signal Processing

The Automotive Industry: A Journey of Innovation

Breaking New Ground in Size and Power Efficiency

Addressing the Challenges of Space-Based Systems

Nexperia Expands CFP Power Diode Portfolio for Enhanced Efficiency in Industrial and Automotive Applications

The unforgiving environment within a car demands exceptional quality and reliability from its components.

ATTEND, 214A Series, RJ45 connector, PoE++, industrial Ethernet, IEEE 802.3bt, high power, durability

MCC Semi, ESD protection diode, ultra-low capacitance, bidirectional, high-speed applications

Innoscience, GaN-on-Silicon MOSFET, enhancement-mode, high-performance, power conversion

Diodes Incorporated, Hall effect switch, automotive, AH332xQ, AH352xQ, position sensing

Vishay, inductors, electronic components, power electronics, automotive, industrial

Nexperia, Zener diode, 50 µA-Zener, noise, overswing, automotive, on-board chargers

XP Power, JMR03/10/20, DC-DC converter, medical-grade, high efficiency, compact design

Toshiba, TLP3450S, photorelay, semiconductor tester, high-speed switching, compact size

Allegro MicroSystems, XtremeSense TMR, current sensor, high-power, efficiency, reliability

MCC, TVS diode, SM6S24AHE3, overvoltage protection, ESD protection, AEC-Q101

Infineon, StrongIRFET 2, power MOSFET, 30V, mass market, efficiency, robustness

USB-C 240W, fast charging, power delivery, USB PD, USB Type-C, EPR, charging technology

Lattice MachXO5D-NX: Secure and Powerful FPGAs for the Evolving Edge

Optimized for Medical, Industrial, and IoT Applications

Cinch Connectivity Solutions Unveils a Powerful and Adaptable Transceiver

SiC is a revolutionary material rapidly gaining traction due to its exceptional properties

MIL-DTL-38999 Series III Space Grade, circular connector, space applications, harsh environments, quick mating, robust scoop proof, extended performances, broad range

Qualcomm Snapdragon 7+ Gen 3, mobile processor, CPU performance, GPU performance, on-device AI, generative AI, Wi-Fi 7, HBS multi-link, Snapdragon 8 series, Snapdragon 7 series

The new family of trench Schottky diodes encompasses 28 variants, catering to a wide range of design requirements.

The ZWS-C series delivers rated power outputs of 10W, 15W, 30W, and 50W, making them suitable for various industrial applications.

intel,cpu,computing,desktop processors,Intel Core i9-14900KS